Bonding Strength Test Service | JTL
Evaluation Test > Service > Material Property Evaluation > Mechanical Property Evaluation > Bond Strength Test Service
We will conduct an evaluation of the bonding strength of micro joints in semiconductor components and electronic components.
In this service, we conduct bonding reliability evaluations of various components in assembly and mounting processes using a bonding strength testing machine (bond tester). We specialize in bonding strength tests for electronic components (shear tests and pull tests), making it suitable for evaluating high-density mounted components. In addition to electronic components, we can also perform bonding strength evaluations on various products and materials in their original state. We have a variety of load cells available, and we design and manufacture original jigs in-house, allowing us to provide flexible responses that are not affected by material or shape.
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basic information
【Adoption of Bump Pull Test Method】 BGA/CSP solder balls can undergo bump pull tests under both heated melting and non-melting conditions. This system can also be used to conduct adhesion strength tests on pads. 【Support for Various Shear Tests】 We also accommodate various traditional shear tests. While we have a range of advanced tools available, if it is difficult to use generic tools, we will create original jigs to conduct the tests. 【Support for High-Temperature Testing】 By adopting a heating stage, we can perform joint strength tests at high temperatures (up to a maximum of 300°C). 【Support for Video Recording】 With the adoption of a CCD monitor system, it is possible to record videos of the testing conditions.
Price information
The price varies depending on the exam content, so please feel free to contact us.
Delivery Time
※The delivery date may vary depending on the exam content, so please feel free to contact us.
Applications/Examples of results
- QFP lead 45° pull test - Hook-type wire pull test (aluminum wire) - BGA/CSP solder ball pull test (non-melting type / 450μm) - QFP lead 90° pull test - Copper foil 90° peel test - BGA/CSP solder ball pull test (heated melting type) - Land pull test - Chip component (small) shear test - BGA/CSP solder ball shear test - Chip component (large) shear test - Shear test for various surface mount components
Company information
Our main business is providing technical services to evaluate the reliability of developed products. We not only provide evaluation data in accordance with standards and regulations, but also propose optimal methods, conditions, and equipment for evaluation purposes, as well as design and manufacture original equipment and jigs for non-standard evaluations. Additionally, we handle three evaluation techniques—measurement, testing, and analysis—comprehensively, allowing us to offer complex services that span diverse equipment and suggest more multifaceted evaluation methods.
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