UV-curable high airtightness and low permeability sealant compatible with reflow processes. Ideal for sealing CCD and CMOS packages.
A UV-curable high airtight and low moisture permeability sealant suitable for the sealing of image sensor packages such as CCD and CMOS. It is also compatible with high-temperature reflow processes for lead-free solder. In addition to ceramic packages, it exhibits good adhesion to plastic packages as well.
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basic information
UV-curable high airtight and low permeability sealant - Excellent fluidity for seal shape drawing - In addition to high airtightness and low permeability, it has low outgassing and high reliability - Compatible with 260°C reflow processes - Suitable for both ceramic and plastic packages in sizes ranging from small to large ● For more details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
CCD package sealing CMOS package sealing, etc. ●For more details, please contact us.
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Company information
We are a company that develops functional resins for industrial applications, focusing on UV-curable adhesives. With a proactive contribution to society, valuable creative activities for our customers, and new challenges as our three fundamental pillars, we have been expanding our business. Moving forward, we aim for further leaps by fostering a flat corporate culture where every employee can "speak freely," regardless of hierarchy, and by creating value that satisfies our customers, allowing each individual to progress and grow. Additionally, we are a leading company in advanced industries centered around global electronics, specializing in marketing and technology to develop our business.
