Explanation of functional control of polyimide resin (molecular design, surface modification, composite materials) and characteristics (heat resistance, low dielectric constant, transparency, low thermal expansion, etc.)!
○Publication Date: April 24, 2008 ○Format: B5 size, hardcover, 300 pages ○Price: 60,000 yen (excluding tax) → STbook member price: 56,952 yen (excluding tax) ○Contributors: Toshihiko Matsumoto, Tokyo University of the Arts / Yasuji Yamada, Kyoto Institute of Technology / Tomoyuki Suzuki, Nagoya Institute of Technology / Yusuke Nakai, Nagoya Institute of Technology / Akira Iwamori, Kanazawa University / Toshio Ogawa, Kanazawa Institute of Technology / Chikara Takeichi, Toyohashi University of Technology / Yoshiyuki Oishi, Iwate University / Kenichi Fukukawa, Mitsui Chemicals, Inc. / Masatoshi Hasegawa, Toho University / Yuichi Ishida, Japan Aerospace Exploration Agency / Yusuke Tsuda, Kurume National College of Technology / Hiroshi Itaya, Solvay Industries, Inc. / Shinsuke Yamashita, Toray DuPont Co., Ltd. / Naoto Nagai, Niigata Industrial Technology Comprehensive Research Institute / Takashi Oguni, Toray Engineering Co., Ltd. / Takumi Ueno, Hitachi Chemical Co., Ltd. / Gōji Maeda, Toyo Spinning Co., Ltd. / Masatoshi Yuasa, Nippon Steel Chemical Co., Ltd. / Kenichi Okamoto, Yamaguchi University / Takaki Takagata, Yamaguchi University of Science and Technology / And 6 others.
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basic information
Chapter 1: Functional Control of Polyimides through Molecular Design, Surface Modification, and Composite Formation Section 1: Functional Design and Synthesis - Focusing on Polyimides with Multi-Aromatic Structures Section 2: Functional Control of Polyimides through Alloying and Compositing Section 3: Surface Treatment and Modification of Polyimides Section 4: Characterization of Surface Treatment States of Polyimides Chapter 2: Improvement and Control of Various Properties of Polyimide Resins Section 1: Enhancement of Heat Resistance in Polyimides Section 2: Reduction of Dielectric Constant in Polyimides Section 3: Improvement of Adhesion and Cohesion in Polyimides Section 4: Transparency and Refractive Index Control of Polyimides Section 5: Increased Sensitivity of Photosensitive Polyimides Section 6: Reduction of Thermal Expansion in Polyimides Section 7: Control of Water Absorption in Polyimides Section 8: Improvement of Molding Properties of Polyimides Section 9: Enhancement of Solubility in Polyimides Section 10: Functionalization of Soluble Polyimide Polymers Chapter 3: Application Technologies of Polyimides
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Main unit 60,000 yen + tax → STbook member price: 56,952 yen + tax
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S&T Publishing publishes technical books aimed at researchers and engineers.
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