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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Etching Equipment
  6. Introduction of processed shapes and metal etching specifications.

Introduction of processed shapes and metal etching specifications.

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last updated:Oct 18, 2013

伸光写真サービス
伸光写真サービス
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We will introduce the processing shapes, cross-sectional shapes, and dimensional tolerances of metal etching.

We will introduce the processing shapes, cross-sectional shapes, and dimensional tolerances of metal etching conducted by Shinko Photo Service Co., Ltd. If you are considering metal etching from Shinko Photo Service Co., Ltd., please take a look. We can process thicknesses from 0.005t to 2.0t. If you require other plate thicknesses, please consult us. We can process stainless steel, steel materials and alloys, brass, aluminum, phosphor bronze, beryllium copper, nickel, permalloy, and others. Etching will have R (radius) on the outer and inner corners, approximately 40% of the thickness for the outer corners and 80% for the inner corners. Dimensional tolerances vary depending on the thickness, so we allow for a certain range. Generally, a tolerance of ±10 to 15% of the thickness is standard, but for prototypes and small lots, we can accommodate even stricter requirements, so please consult us in advance. The minimum D dimension will correspond to the thickness, which is MIN/100μ. The minimum W dimension will be equivalent to 1/2 of the thickness, which is MIN/50μ. In etching processing, a bridge (connector) is necessary. For more details, please contact us.

    Etching Equipment
ettinngusiyou.JPG

Introduction of processed shapes and metal etching specifications.

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ettinngusiyou.JPG
  • Related Link - http://www.shinko-ps.co.jp/metal/spec.html

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【Features】 ○ Processing thickness can be from 0.005t to 2.0t ○ The outer corner radius is approximately 40% of the thickness ○ The inner corner radius is approximately 80% of the thickness ○ Dimensional tolerance is typically ±10-15% of the thickness ○ The side edge for double-sided etching is within 10% of the thickness ○ The side edge for single-sided etching is within 20% of the thickness ○ Minimum D dimension is equivalent to the thickness (MIN/100μ) ○ Minimum W dimension is equivalent to 1/2 of the thickness (MIN/50μ) ○ Non-bridging is possible [Materials that can be processed] ○ Stainless steel ○ Steel and steel alloys ○ Brass ○ Aluminum ○ Phosphor bronze ○ Beryllium copper ○ Nickel ○ Permalloy, etc. ● For more details, please contact us.

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List of materials for handling high-frequency substrates

List of materials for handling high-frequency substrates

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[Example] Printed Circuit Board - Multi-layer Board with Different Materials

[Example] Printed Circuit Board - Multi-layer Board with Different Materials

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伸光写真サービス

伸光写真サービス

Manufacturing and processing contract

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We will introduce information about Shinko Photo Service, a company that continues to grow alongside the development of the electronics industry through printed circuit board manufacturing and metal etching, as well as its main clients.

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The related categories of Etching Equipment

  • Manufacturing and processing machinery
  • Semiconductor Manufacturing Equipment
  • Etching Equipment
          

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