We will introduce the key points for measuring ultra-thin, high-precision components.
We will introduce key points for reducing man-hours and improving quality in wire electrical discharge machining, based on the design and manufacturing of micro-machined parts. Topics include "Key points for measuring ultra-small, thin, high-precision parts," "Measurement points for coaxiality and concentricity in fine parts," "Measurement points for boss machining in high-precision fine parts," "Measurement points for high-precision parts where reference coordinates cannot be established," "Measurement points when dimensions are not recorded in the data," and "Measurement points for high-precision fine parts that tend to warp." For more details, please contact us or refer to the catalog.
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basic information
【Content】 ○ Key points for measuring ultra-thin, high-precision parts ○ Key points for measuring coaxiality and concentricity in fine parts ○ Key points for measuring boss machining in high-precision fine parts ○ Key points for measuring high-precision parts where reference coordinates cannot be established ○ Key points for measuring when dimensions are not provided in the data ○ Key points for measuring high-precision fine parts that exhibit warping ● For more details, please contact us or refer to the catalog.
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Company information
Since its founding in 1970, Goto Seiki has cultivated cutting processing technology, particularly in the field of optical and measuring instruments, where high precision and shape requirements are demanded. This has become the foundational technology for our precision parts manufacturing. In the realm of development and prototyping that supports the forefront of manufacturing, this advanced cutting technology is indispensable. Additionally, we continue to evolve as a versatile group aiming for optimization in precision parts processing using non-ferrous metals and resins, as well as in micro-machining and mold technology.
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