Development of conductive paste and ink centered on silver nanoparticles and low-temperature sintering.
S30845
What is the design technology for low-temperature sintering!? How is it applied to die attach materials?
Conductive Pastes/Inks Using Mainly Ag Nanoparticles: R&D, Sintering at Low Temp., etc. ★What are the design techniques for low-temperature sintering!? Applications to die attach materials? ★How can we create a dense structure to ensure conductivity!? ★Let's learn about the latest development trends focusing on storage stability, adhesion to substrates, and heat resistance after sintering!! 【Venue】 Kawasaki City International Exchange Center, 2F, Room 4 【Kanagawa, Kawasaki】 Date and Time August 9, 2013 (Friday) 13:30-17:45
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basic information
**Part 1: Summary of the Lecture** The industrialization of printed electronics using silver nanoparticles as electrode materials is becoming increasingly realistic. The challenge now is how to synthesize high-performance, high-purity silver nanoparticles at a low cost and in large quantities. Additionally, there is a demand for ease of customization according to the individual needs of users. This section will introduce the characteristics of silver nanoparticles that can be sintered at low temperatures (below 100°C). It will also discuss Yamagata University's efforts towards the low-cost, large-scale synthesis of "diverse silver nanoparticles," differentiation through coating film structures, and the practical application and industrialization of these materials. Finally, it will touch upon copper-silver and copper nanoparticles that exhibit excellent oxidation resistance. **Part 2: Summary of the Lecture** Metal nanoparticle materials centered around silver (Ag) are beginning to enter the market for applications such as printed electronics. An important point that determines the characteristics of these materials is the phenomenon of nanoparticles sintering at low temperatures to become conductive, known as low-temperature sinterability. This lecture will introduce key design points related to low-temperature sinterability through previous research examples. Additionally, the current state of market development will also be presented.
Price information
Until August 9th, the early bird discount price is 54,600 yen (including tax and text fees) for up to 2 people from one company.
Price range
P2
Delivery Time
P2
Applications/Examples of results
Part 1: Challenges for Low-Temperature Sintering and Optimal Structure Control of Silver-Centered Nanoparticles Towards Next-Generation Pastes [13:30-14:45] Instructor: Yamagata University [Program] 1. Synthesis Strategies for Silver Nanoparticles and Steady Industrialization 2. Challenges in Silver Nanoparticle Production 3. Characteristics of Silver Nanoparticles 4. Yamagata University's Efforts Towards Practical Application and Industrialization 5. Copper Nanoparticles 6. Silver-Copper Alloy Nanoparticles Part 2: Design of Ag Nanoparticles for Realizing Low-Temperature Sintering Technology and Their Application in Pastes [15:00-16:15] Instructor: Bandō Chemical Co., Ltd. [Program] 1. Design of Low-Temperature Sinterability for Metal Nanoparticle Pastes Centered on Ag 2. Types of Metal Nanoparticle Inks 3. Application Examples of Low-Temperature Sinterable Ag Nanoparticles Part 3: Circuit Printing for Touch Panels Using Conductive Silver Paste [16:30-17:45] Instructor: Toyo Chem Co., Ltd. [Program] 1. Fine Line Circuits in Touch Panels 2. Circuit Formation Methods 3. High-Resolution Printing by Screen Printing 4. Paste and High-Resolution Printing 5. Movements Towards Further High Resolution
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