What is the method to increase the electrical conductivity of metals just by drying, without the need for sintering!?
★Let's understand the mechanism by which π electrons connect between metal nanoparticles to ensure conductivity!! ★Why is it possible to achieve conductivity exceeding 9 μΩcm for gold nanoparticles and 30 μΩcm for silver nanoparticles?! 【Instructor】 Masayuki Kanbara, Specially Appointed Assistant Professor, Okayama University Advanced Research Core for Interdisciplinary Fields 【Venue】 Tokyo Chuo City Industrial Hall, 4th Floor, Meeting Room 1【Tokyo, Chuo Ward】 【Date and Time】September 24, 2013 (Tuesday) 13:30-16:30
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【Keywords】 1. Low-temperature sintering 2. Metal nano ink 3. Printed electronics 【Abstract】 In this seminar, we will provide a fundamental explanation of solution conductive materials that are essential in the coating process for various device manufacturing. We will also detail the technological trends of metal nanoparticles that form electrodes and wiring through coating and drying at room temperature.
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For 2 people: 53,550 yen ⇒ Special service price 46,200 yen (including tax and text costs)
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P2
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P2
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**Program** 1. What are Metal Nanoparticles 1-1 Structure of Metal Nanoparticles 1-2 Types of Metal Nanoparticles 1-3 Overview of Synthesis Methods for Metal Nanoparticles 1-3-1 Gas Phase Evaporation Method 1-3-2 Atomization Method 1-3-3 Chemical Reduction Method 1-3-4 Other Methods 2. Detailed Synthesis Methods for Metal Nanoparticles 2-1 Hydrophobic Metal Nanoparticles 2-2 Hydrophilic Metal Nanoparticles 2-3 How to Create Stable Metal Nanoparticles 3. Metal Nanoparticles as Conductive Pastes and Inks 3-1 Metal Nanoparticle Pastes from Various Companies 3-2 Previous Development Directions 3-3 Reducing Sintering Temperature 4. Room Temperature Conductive Metal Nanoparticles 4-1 What is π Bonding 4-2 Synthesis Methods for π Bonding Room Temperature Conductive Metal Nanoparticles 4-3 Conductive Properties of π Bonding Room Temperature Conductive Metal Nanoparticles 4-4 Optical Properties of π Bonding Room Temperature Conductive Metal Nanoparticles 4-5 Device Fabrication of π Bonding Room Temperature Conductive Metal Nanoparticles 4-6 Conclusion
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