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  6. Tabletop Wire Bonder and Bonding Tool Comprehensive Catalog

Tabletop Wire Bonder and Bonding Tool Comprehensive Catalog

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last updated:Nov 14, 2013

TPTジャパン
TPTジャパン
  • Official site

High precision, low cost, multifunctional... Comprehensive catalog of desktop wire bonders and bonding tools.

This is a comprehensive catalog featuring a wide variety of tabletop wire bonders from TPT, ideal for research and development with high-precision bonding and excellent operability. With this single unit, both wedge bonding and ball bonding are possible. We also offer various bonding tools such as capillaries and wedge tools. Please feel free to consult us for sample requests or tool selection. 【Featured Products】(Partial Introduction) ○ Tabletop Wire Bonder → Semi-auto / Manual / Full Manual / Wedge for Thick Wire ○ Bonding Tools → YAG Laser Thin Film Processing System → Photon Emission Microscope System and more For further details, please download the catalog or contact us.

    Bonding EquipmentOther semiconductor manufacturing equipment
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Tabletop Wire Bonder and Bonding Tool Comprehensive Catalog

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  • Related Link - http://www.tpt-japan.com/products.html

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【Featured Products and Characteristics】 ○ Desktop Wire Bonder Semi-Auto HB16: Pursuing high-precision bonding and operability ○ Desktop Wire Bonder Manual HB10: Well-equipped functions and stable bonding ○ Desktop Wire Bonder Full Manual HB05: Focused on price with minimal functions ○ Desktop Wire Bonder for Thick Wires Semi-Auto HB30: Desktop thick wire wedge bonder ○ Capillary: High quality and long lifespan due to ultra-high-density finishing ○ YAG Laser Thin Film Processing System: Fine processing system for metals and organic thin films using high-quality laser irradiation ○ Photon Emission Microscope System: Ideal for state confirmation and defect analysis during design and development stages ○ Electrical Measurement Cables: Low price, short delivery time, and three types available ○ Electrical Measurement Connectors and Triaxial Adapters: Please inquire for special specifications. ○ Micro Positioner PH10/PH18: Adopts an ant colony groove method, emphasizing cost while ensuring excellent operability ○ High-Precision DC Coaxial Probes APT Series: Reduces electrical constraints and noise or leakage caused by cable connections ○ Probe Needles: Available in various materials and tip shapes For more details, please download the catalog or contact us.

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Tabletop Wire Bonder and Bonding Tool Comprehensive Catalog

Tabletop Wire Bonder and Bonding Tool Comprehensive Catalog

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TPTジャパン

TPTジャパン

Electronic Components and Semiconductors

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Leave manual wire bonders, ball bonders, and wedge bonders to TPT Japan. With excellent cost performance and a durable form, we respond flexibly to customization, making them more functional and versatile.

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