The prevention of solder ball scattering for thick wire solder allows for a reduction in work takt time.
This is a device for preheating solder wire so that thick solder wire melts smoothly. It is effective for preventing solder ball scattering, shortening tact time, and extending the lifespan of the soldering tip. It supports a wide range of solder diameters from φ1.0 to 1.6 (φ0.8 is a special specification).
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basic information
For more details, please refer to the catalog page or contact us via the inquiry form. Apollo Seiko Contact Page: http://www.apolloseiko.co.jp/contact/index.html Apollo Seiko Co., Ltd. Headquarters: 0550-88-2828
Price range
P3
Delivery Time
※Delivery times may vary depending on quantity and specifications, so please feel free to contact us.
Applications/Examples of results
Soldering of thick wire solder.
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Company information
~Founded in 1969~ We invented the world's first "automatic soldering machine." Since our establishment, we have continuously conducted research, development, and investigation into the automation of soldering, always striving to be a reliable partner for our customers. We provide consistent "consulting for automatic soldering" from pre-introduction proposals to after-sales support. With 50 years of accumulated experience, unique technology, and a rich product lineup, we enable all forms of automatic soldering. We can provide support from various regions both domestically and internationally. <Domestic Bases and Group Companies> Headquarters and Factory (Shizuoka) / Tokyo Branch / Osaka Branch / Nagoya Sales Office / Kyushu Sales Office <Overseas Local Corporations (Service Bases)> United States / Europe / China / South Korea / Thailand / Singapore / Mexico / India <Overseas Agents> Taiwan / Vietnam / United Kingdom / Brazil / Russia / Poland / Czech Republic / Philippines / France / Hungary / Ireland / Italy
