This is an ion beam etching device that uses an ion source to irradiate the target material with an ion beam and perform dry etching.
The small ion beam etching device uses a DC ion source and is an ion beam etching (IBE) device equipped with a substrate rotation cooling single stage. It is capable of etching fine patterns, as well as metal and magnetic materials. 【Features】 ○ Easily etches Au, Pt, magnetic materials, etc. ○ Taper processing is easy ○ Processing is possible at substrate surface temperatures below 80°C ○ No toxic gases are used, so exhaust gas treatment is unnecessary ○ Can be equipped with an endpoint detector For more details, please contact us or download the catalog.
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【Device Specifications Overview】 ○ Etching Ion Source → DC 11cm ION SOURCE → SOLUS POWER SUPPLY ○ Vacuum Chamber → Achievable Pressure: 6.0×10-5 Pa range → Operating Pressure: 3.0×10-2 Pa range ○ Single Stage → Water Cooling Mechanism → 3-axis Operation: Rotation, Incident Angle, Arc Movement → Amorphous Substrate up to Max 6 inches selectable ○ Exhaust System → Main Exhaust: TMP or Cryo-pump → Roughing: Dry Pump or Rotary Pump ● For more details, please contact us or download the catalog.
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Company information
Our company started in 1988 as an overseas export trading company for vacuum thin film manufacturing equipment, and has expanded its operations as a "total planner of vacuum technology" up to the present day. During this time, we have focused on the development of optical thin film materials, as well as the sales of ion beam processes and refrigeration units (Sapcold). Additionally, we have developed and are set to launch the GCIB (Gas Cluster Ion Beam) process equipment, which is expected to be an important technology in the next generation of nano-processing. Starting with glasses and camera lenses, we now see new media continuously emerging in the optical-related industry, including digital cameras, mobile phones, and medical lenses.