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  6. Tabletop ACF Bonding Device LD-03

Tabletop ACF Bonding Device LD-03

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LD-03

last updated:Oct 08, 2014

大橋製作所 機器事業部
大橋製作所 機器事業部
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Ideal for R&D and small lot production; can be applied up to a length of 100mm.

It is a compact and simple tabletop ACF bonding device that allows for easy setup changes. It accommodates a wide range of work, including LCDs, FPCs, camera modules, and touch panels.

    Bonding EquipmentOther mounting machinesOther assembly machines
img13alc0933_1.jpg

Tabletop ACF Bonding Device LD-03

img13alc0933_1.jpg
img13alc0933_1.jpg
  • Related Link - http://www.ohashi-engineering.co.jp/products3/inde…

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basic information

This is a device for attaching ACF to one location on the workpiece. The workpiece is suction-fixed to the stage, advanced to the crimping position, and the head descends to attach the ACF. [Specifications excerpt] - Stage: Max. 192(W) x 100(D)mm - ACF attachment length: Max. 100mm - ACF width: 1-7.5mm

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Applications/Examples of results

Corresponding to the following processes: FOB/FOG/FOF/COG/COB/COF

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Tabletop ACF Bonding Device LD-03

Tabletop ACF Bonding Device LD-03

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Company information

大橋製作所

大橋製作所 機器事業部

Industrial Machinery

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Since our founding, we have been comprehensively developing the design, manufacturing, and sales of microelectronics assembly equipment using precision sheet metal processing and ACF bonding technology. Since we began to commercialize the know-how cultivated in sheet metal processing as a tool for improving quality and productivity, we have consistently pursued business diversification and management independence through differentiated technologies. In the field of sheet metal processing, we are capable of vertical integration from product design and development to the assembly of finished products, not just contract processing, providing OEM and ODM (Original Design Manufacturing) products to our client companies. In the area of ACF bonding assembly machines, supported by the rapid development of the FPD industry, our products are adopted by many customers both domestically and internationally. In 1999, our tabletop COG assembly machine, which overturned industry norms, received the annual excellence award from the Nikkei newspaper. We take pride in the fact that the emergence of this tabletop machine has broadened the industry from being the domain of a few large companies to include many small and medium-sized enterprises. We have successfully developed the world's first "full-auto FOB line," and along with our manual tabletop machines and standalone semi-auto machines, we have evolved into a full-line manufacturer of ACF bonding assembly machines.

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