450mm wafer transport system
It can be used for high-speed transport of 450mm wafers. By using a traveling axis, we propose strokes according to the number of ports in the cassette. Adopting AC servo motors, it transports at high speed and high precision through optimized motion trajectories. Bernoulli chucks can be installed (optional). The Z-axis (elevation axis) can accommodate up to 500mm. By employing a traveling axis, it can access 4 FOUPs (450mm wafers) at high speed. Load capacity: Equivalent to 5kgf at the third joint of the arm (including chuck and workpiece). The use of a twin arm reduces wafer exchange time. The wall-mounted traveling axis achieves a low pass line. It is equipped with a motion monitor. Control method: RS232C and parallel photo I/O. S-curve acceleration and deceleration control allows for high-speed, high-precision transport of wafers. It can accommodate optimal chucks tailored to the transported items and equipment layout. Chuck materials can be various, including CFRP, aluminum, and ceramics. It uses AC servo motors with built-in absolute encoders on all axes.
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basic information
Transported Object: ~450mm Silicon Wafer Operating Range: Work Center Distance: Swing Angle (θ-axis): 340 degrees Vertical Stroke (Z-axis): 300mm Slider Stroke (X-axis): 2000mm Transport Speed (Average Speed): Arm (R-axis): 775mm/sec Swing Angle (θ-axis): 280 degrees/sec Vertical Stroke (Z-axis): 300mm/sec Slider Stroke (X-axis): 1300mm/sec Transport Speed (Maximum Speed): Arm (R-axis): 1600mm/sec Swing Angle (θ-axis): 550 degrees/sec Vertical Stroke (Z-axis): 500mm/sec Slider Stroke (X-axis): 2500mm/sec Wafer Holding Method: Vacuum Suction, Drop-in, Edge Grip Chuck, Bernoulli Chuck Cleanliness: ISO Class 2 (ISO14644) (Transport Level during Drive Exhaust) Mass: Robot Body Approximately 60kg, Entire System Approximately 300kg Utility: Power: AC200V±10% 30A, Vacuum: -73kPa or more
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Applications/Examples of results
Semiconductor manufacturing equipment, etc.
Company information
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