SVH/IVH and composite high multilayer substrate for build-up.
Leveraging the strengths of our integrated production from in-house design, we are able to accommodate the production of narrow-pitch composite substrates for high-layer-count boards, such as semiconductor tester products, through a clever combination of design rules that consider substrate manufacturing at the design stage and the unique substrate processes of our small-batch, diverse product lines.
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basic information
We offer a variety of substrate materials including FR-4, halogen-free materials, high Tg materials, and low dielectric materials, and we can manufacture each of them. Additionally, we accept requests for SVH/IVH, build-up, back drilling, some thick copper, and impedance control. For build-up, we utilize our proprietary drilling machine for mechanical build-up processing (Depth Drill), enabling simultaneous processing of two layers (skip processing, such as between L1-3). At the same time, through mechanical processing, we provide products that improve connection reliability by reducing resin residue at inner layer connection points and minimizing damage to inner layer conductors.
Price range
Delivery Time
Applications/Examples of results
Example of combined processing with IVH+ build-up (L1-3, L3-5 available) + inner layer thick copper (200μm).
Company information
P-Dub-B Co., Ltd. has been expanding its business areas related to printed circuit boards since its establishment in 1978, and now has built a consistent production system (ADAMS) that handles everything in-house, from software and hardware design to manufacturing and assembly. We flexibly respond to our customers' increasingly diverse and sophisticated needs.
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