Measurement of Si wafer thickness, front and back surface P/N determination.
Thickness measurement of 4”, 5”, 6”, and 8” Si wafers, determination of front and back P/N, and resistivity measurement will be conducted, and based on the results, sorting will be performed into cassettes that have been pre-set in the recipe.
Inquire About This Product
basic information
- Before measurement, the sensor uses a calibration gauge for automatic calibration. - The measurement location and number of measurement points will be adjusted according to the customer's request.
Price range
Delivery Time
※Please consult with us.
Applications/Examples of results
Measurement of Si wafer thickness and front/back surface P/N determination.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.