This is a device that extracts silicon wafers from a dedicated cassette using edge handling and measures the thickness of a set pattern.
By holding three points on the outer circumference of the silicon wafer and rotating the θ table, the thickness at any location can be measured. Our unique "non-contact earth" method allows for safe, non-contact handling.
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basic information
Equipped with a barcode reader and laser marking reading function, it can save the scanned barcode numbers, two-dimensional codes, or text into specified cells in Excel.
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Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.