Large-diameter silicon wafer measuring instrument
- The thickness of the silicon wafer will be measured non-contact. - A laser length measuring device will be used to measure the thickness. - The thickness measurement data will be saved on a PC.
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basic information
The measurement data can be displayed as follows: 1. Multi-point measurement display 2. Cross-sectional thickness measurement display 3. Thickness measurement map display
Price range
Delivery Time
Applications/Examples of results
This device is developed as a measurement instrument for large-diameter silicon wafers.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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