The very popular TME series
□TME-02A Type/TME-02B Type□ This is a device that extracts silicon wafers from a dedicated cassette using edge handling and measures the thickness of a set pattern. It holds three points on the outer circumference of the silicon wafer and rotates the θ table to measure the thickness at any desired location. Thanks to our unique "non-contact earth" method, it allows for safe and non-contact handling. It is equipped with a barcode reader, and the scanned barcode number can be saved in a specified cell in Excel. □TME-03 Type□ This is a device that extracts silicon wafers from a dedicated cassette and measures the thickness of a set pattern. The chucking of the silicon wafer during transport and measurement at the stage uses vacuum to hold the backside.
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☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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