This is a device that removes silicon wafers from a dedicated cassette and measures the thickness at the set points.
- The wafer thickness is measured non-contact using a capacitance sensor. - Wafer size changes are possible through recipe settings, eliminating the need for setup changes. - The measurement point is set to one point at the center, with cross measurements configured in the recipe. The number of points and their positions during cross measurements can also be specified. - The measured data is saved on the accompanying computer.
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basic information
The wafer thickness corresponds to 100μm to 1800μm. (Depending on the wafer size.)
Price range
Delivery Time
Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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