This machine is a device for measuring the thickness of φ8” silicon wafers.
It is a device that performs non-contact, automatic measurements of the thickness of Si wafers and various measurements of Si step parts.
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basic information
- Improvements have been made in operability and mechanisms compared to the previous model TME-06. The mechanism has been simplified, and operability has been enhanced with a focus on operator convenience. - Three types of sensors have been installed, enabling a wide variety of measurements. - It supports HOST communication via SECS and HSMS communication.
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Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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