Start of contract for SIM-like 3D reconstruction analysis! *Recommended for material development and troubleshooting in semiconductors and substrates!
We have started offering contracted 3D reconstruction analysis of SIM images using FIB processing observation equipment! We can be of assistance in various fields such as material development, semiconductors, and troubleshooting of substrates! 【High-precision and high-resolution observation of semiconductor device failure analysis and work cross-sections/layer structures】 The focused ion beam (FIB) processing equipment can perform slicing with small, evenly spaced pitches and has the capability to capture images at each step. By utilizing this function, we can achieve high-precision exposure of work cross-sections and high-resolution image acquisition, allowing for the observation of cross-sectional shapes and layer structures of small workpieces. For example, it enables failure analysis of semiconductor devices, observation of wire bond cross-sectional shapes, and verification of plating layer structures and thicknesses. 【Features】 ■ Sequential processing and observation to create reconstruction data ■ High-precision overlay of slice data to create high-quality 3D data ■ Slice pitch can be set from 1nm to 1μm ■ High-resolution observation of SIM images ■ Observation targets: capable of handling up to 200µm ■ Capable of observing even very small targets that may be obscured by polishing processes *For details such as analysis examples, please contact us or download and view the catalog.
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basic information
【Analysis Method】 - Repeatedly perform and observe evenly spaced slice cross-section processing to obtain multiple cross-sectional SIM images for 3D reconstruction. - To observe the processed surface almost vertically, high-quality images can be used to create reconstruction data. 【Analysis Example】 - Sample: Au wire bonding part of a light sensor - Processing size: Width 100µm, Height 100µm, Slice pitch 0.5μm 【Application Examples】 - Observation for failure analysis of power semiconductors, etc. - Observation of cross-sectional shape of wire bonding parts - Observation of the layered structure and thickness of plating, etc.
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Company information
Precision micro-machining technology is increasingly recognized as a common foundational technology that supports modern advanced industries. Since its establishment in 1955, Toray Precision Co., Ltd. has manufactured spinnerets, which are key technologies for synthetic fiber production, and has contributed to the development of the synthetic fiber industry by providing them to fiber manufacturers worldwide, including Japan and Europe and the United States. Meanwhile, the experience and technology gained during this time in precision micro-machining have been widely applied to other industrial sectors. Precision machined components are incorporated into critical parts of aircraft, industrial robots, measurement and control equipment, etc. Additionally, the specially developed and designed fluid nozzles have demonstrated their functionality as important components in various industrial machines. The ultra-precision micro-machining technology, boasting sub-micron precision, is also utilized in the optical communication field, which is essential for realizing a highly information-oriented society. We have also commercialized various optical devices, including optical components such as ferrules and adapters. As a pioneer in ultra-precision micro-machining technology, we will continue to contribute to society by delivering high-precision, high-quality products.
