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  3. Electronic Components and Modules
  4. Electronic Components
  5. Printed Circuit Board
  6. Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

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last updated:Oct 07, 2022

サトーセン
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Introducing technology for improving V-cut position accuracy! High-precision V-cut method using CCD.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm through improvements in V-cut and pattern positioning. The pattern formation is made possible by the LDI (Laser Direct Imaging) method, and the V-cut is achieved using a high-precision V-cut method with CCD. We enhance hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling equipment and X-ray measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Flat plugs (pad-on-via) allow for mounting on through-holes ○ Landless through-holes enable compatibility with narrow pitch patterns ○ Ultra-fine printing is possible (1 character: vertical 0.28 × horizontal 0.15 mm) Please contact us for more details.

    Printed Circuit Board
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Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

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  • Related Link - http://www.satosen.co.jp/technology/board.html

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【Technical Introduction】 ○ Circuit Formation → Achievements up to ±30μm ○ Gold Plating for Bonding → Over 25 years of experience with COB substrates ○ Silver Plating for Bonding → Capable of electroless silver plating ○ Resin Leakage Prevention → Prevents resin leakage by permanently filling holes with epoxy ○ Dimensional Accuracy → Achievements up to ±50μm ○ V-Cut Position Accuracy → Achievements up to ±50μm ○ Counterboring → High-precision counterboring is possible ○ High Frequency → Impedance matching as per requirements is possible, reducing noise ○ LED Brightness → Reflectivity can be improved through substrate, plating, and solder resist ○ Heat Dissipation → Heat dissipation is possible through pattern design, selection of heat-dissipating materials, and setting conductor thickness ○ Miniaturization → Miniaturization with integrated rigid-flex printed circuit boards ○ Mounting → Easy-to-mount pattern design implemented at the design stage ○ Magnetism → Magnetism can be reduced by selecting nickel plating solutions ○ Dust Prevention → Mass production achievements in optical systems through optimization of router programs and dust collection techniques during and after processing ● For more details, please contact us.

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サトーセン

Electronic Components and Semiconductors

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Sato-sen Co., Ltd. provides high-quality printed circuit boards that meet the increasing demands for high functionality and high precision, by proposing solutions to the concerns and problems of those involved in design, development, technology, and purchasing. Sato-sen offers customized, high-quality products and services tailored to various customer needs. As a partner company for our customers, Sato-sen delivers high added value throughout all processes, from design and development to production and delivery. Furthermore, by thoroughly adhering to a customer-first principle, we provide high-quality products and services with flexible and meticulous responsiveness, ensuring that customers receive what they want, when they want it.

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