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  1. Home
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  6. Technical Introduction: "High-Frequency Technology"

Technical Introduction: "High-Frequency Technology"

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last updated:Oct 07, 2022

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Introducing high-frequency technology! We provide substrates that match the impedance of mounted components and the circuit board.

At Sato-Sen Co., Ltd., we can achieve the desired impedance matching and noise reduction through circuit design for high frequency, material selection, layer configuration, and impedance simulation based on patterns. Furthermore, we provide quality assurance with impedance measurement substrates. We also have design simulation capabilities for high frequency and a long history of mass production in the gigahertz range. 【Features】 - We offer substrates that match the impedance of mounted components and the board, which is required due to the increasing speed of transmission signals. - Using our in-house simulation software, we provide high-frequency printed circuit boards that meet your satisfaction through optimal material selection, layer configuration, and circuit design. → High-precision impedance control is possible due to our extensive database. - Impedance measurement can be conducted using our measurement equipment (TDR) with test coupons. → Compatible with Z0±7%, and prototypes can be made with ±5%. Please contact us for more details.

    Printed Circuit Board
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Technical Introduction: "High-Frequency Technology"

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  • Related Link - http://www.satosen.co.jp/technology/high-frequency…

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**Technical Introduction** ○ Circuit Formation → Achievements up to ±30μm ○ Gold Plating for Bonding → Over 25 years of experience with COB substrates ○ Silver Plating for Bonding → Capable of electroless silver plating ○ Resin Leakage Prevention → Resin can be prevented from leaking by permanently filling holes with epoxy ○ Dimensional Accuracy → Achievements up to ±50μm ○ V-Cut Position Accuracy → Achievements up to ±50μm ○ Counterboring → High-precision counterboring is possible ○ High Frequency → Impedance matching as per requirements is possible, allowing for noise reduction ○ LED Brightness → Reflectivity can be improved through substrate, plating, and solder resist ○ Heat Dissipation → Heat dissipation is possible through pattern design, selection of heat-dissipating materials, and setting conductor thickness ○ Miniaturization → Miniaturization achieved with integrated rigid-flex printed circuit boards ○ Mounting → Easy-to-mount pattern design implemented at the design stage ○ Magnetism → Magnetism can be reduced by selecting nickel plating solutions ○ Dust Prevention → Achievements in mass production for optical systems through optimization of router programs and dust collection techniques during and after processing ● For more details, please contact us.

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Electronic Components and Semiconductors

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Sato-sen Co., Ltd. provides high-quality printed circuit boards that meet the increasing demands for high functionality and high precision, by proposing solutions to the concerns and problems of those involved in design, development, technology, and purchasing. Sato-sen offers customized, high-quality products and services tailored to various customer needs. As a partner company for our customers, Sato-sen delivers high added value throughout all processes, from design and development to production and delivery. Furthermore, by thoroughly adhering to a customer-first principle, we provide high-quality products and services with flexible and meticulous responsiveness, ensuring that customers receive what they want, when they want it.

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