Injection Molding Internal Pressure Monitoring System ComoNeo 5887A

We will be exhibiting at the "Automotive Technology Exhibition 2026 NAGOYA," which will be held from June 17. At the Nagoya exhibition, we will introduce sensing systems that can assist in process improvements aimed at enhancing efficiency and reliability in automotive parts production processes. If you have any challenges or requests related to automotive manufacturing, please feel free to consult our staff on-site during your visit! - Dates: June 17 (Wednesday) - 19 (Friday), 2026, 10:00 AM - 5:00 PM - Venue: Aichi Sky Expo (Aichi International Exhibition Center), 5-10-1 Centrair, Tokoname City, Aichi Prefecture, 479-0881 - KISLA Booth: No. 83

We will be exhibiting at the "Automotive Technology Exhibition 2026 NAGOYA," which will be held for three days from June 17. At the Nagoya exhibition, we will introduce sensing systems that can assist in process improvements aimed at enhancing efficiency and reliability in automotive parts production processes. When you visit, please stop by our booth and feel free to consult with our staff on any challenges or requests you may have. We look forward to seeing you at the venue and sincerely await your visit. - Dates: June 17 (Wednesday) - 19 (Friday), 2026, 10:00 AM - 5:00 PM - Venue: Aichi Sky Expo, 5-10-1 Centrair, Tokoname City, Aichi Prefecture, 479-0881 - Kisarab Booth: No. 83

In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (New Energy Vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins like epoxy transfer molding and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not cause measurement errors due to the intrusion of epoxy resin (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held three times on the following dates, but the content will be the same for all sessions, so please feel free to join on a date that suits you! April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.

In the semiconductor industry, especially in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not produce measurement errors due to resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% for the measurement range - Resolution ⇒ 1/1,000 MPa May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to the participation of many people.