Equipped with the latest ultrasonic oscillator Pro! Ultrasonic metal joining machine catalog now available.
"Unlimited charm of ultrasonic oscillators × astonishing bonding reproduction power" What matters is controlled energy transfer! Proposing suitable metal bonding according to the application.
Equipped with a servo press that efficiently transmits ultrasonic energy to the workpiece and an oscillator from RINCO with excellent ultrasonic control functions. It suppresses deformation and slipping of the base material during joining, preventing cracks and disconnection troubles. Additionally, if you want to realize your company's ideals rather than standard products, consultations are welcome. We will support you while sharing know-how for each customer's application, so modifications and program adjustments are also accepted. 【Features】 ■ Settings can be adjusted according to material characteristics ■ Customization and program modifications are possible ■ Support available for overseas deliveries *For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Joining copper and aluminum wire conductors to terminals ■ Joining lead terminals to power modules and DBC substrates ■ Joining electrodes of laminated aluminum foil for secondary batteries and capacitors ■ Joining non-ferrous metals, etc. *For more details, please refer to the PDF document or feel free to contact us.
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![[Latest Edition] Free Comprehensive Catalog from UC Japan Co., Ltd.](https://image.mono.ipros.com/public/catalog/image/364145/IPROS894009015785865999.jpeg?w=120&h=170)
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
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