High efficiency through high-speed processing! Laser system equipped with LD-excited solid UV laser.
The ultraviolet wafer scribing device "ULTRA SCRIBER" is equipped with an LD-excited solid UV laser and is mainly applied for precision fine scribing of wafers. It features a 4-axis platform system with X-Y-Z-θ, where the X-Y stage has a stroke of 120mm and a resolution of 0.1μm. 【Features】 ■ Special V-shaped cutting edge ■ High efficiency through high-speed processing ■ Compatible with 4-inch wafers (expandable) ■ Automatic image recognition and positioning system For more details, please refer to the catalog or feel free to contact us.
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basic information
【Specifications】 ■Laser: Solid-state laser 355nm ■Maximum processing range: 4 inches ■X-Y-Z and θ four-axis platform system ■High-speed four-axis drive control system ■Coaxial image CCD system ■Granite base vibration isolation device ■Processing capacity: 9pcs/h - 32pcs/h (depending on crystal particle size) *For more details, please refer to the catalog or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Silicon wafer scribing ■ Compound wafer scribing, etc. *For more details, please refer to the catalog or feel free to contact us.
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Company information
Delphi Laser Japan Co., Ltd. engages in equipment sales, equipment development, laser processing, maintenance, and more in the Japanese market. The headquarters, Delphi Laser, is a joint venture between China and Australia, focusing on the development, manufacturing, and sales of laser equipment applied in various high-end industries. In particular, devices equipped with ultraviolet lasers and ultrashort pulse lasers leverage the characteristics of laser microprocessing and are widely applied in the precision microprocessing fields of solar cells, LEDs, LCDs, touch panels, and more.
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