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  6. Contract processing of surface modification using GCIB (Gas Cluster Ion Beam).

Contract processing of surface modification using GCIB (Gas Cluster Ion Beam).

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last updated:Nov 28, 2022

東邦化研
東邦化研
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We will flatten the surface irregularities of your circuit board at the nano level!

Toho Kaken Co., Ltd. has started offering contract processing services for 'surface modification' using GCI (Gas Cluster Ion Beam), in addition to its contract processing services for thin films, leveraging the vacuum know-how cultivated through its film formation technology and the experience gained from thin films.

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プレゼンテーション1.jpg

Contract processing of surface modification using GCIB (Gas Cluster Ion Beam).

プレゼンテーション1.jpg
プレゼンテーション1.jpg
  • Related Link - http://www.tohokaken.jp/gcib.html

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GCIB (Gas Cluster Ion Beam) is a technology that flattens the surface state of a target object at the nanoscale level. In a vacuum, clusters of Ar atoms, numbering in the thousands, are ionized and accelerated to collide with the target object. The high-energy collisions of the Ar clusters create impact marks on the surface of the target object, resembling craters. By repeating these collisions on the surface of the target object, "surface modification" becomes possible. This allows for the flattening of surface roughness from 3-10 nm down to approximately 1 nm. - Compatible substrates: There are no restrictions on materials, including metals, SUS materials, and glass substrates; however, for resin films, please consult separately as the heat generated during irradiation may be slightly higher. - Compatible sizes: The standard compatible size is 200×200×t20 (mm). For larger sizes, please consult separately.

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Contract processing of surface modification using GCIB (Gas Cluster Ion Beam).

Contract processing of surface modification using GCIB (Gas Cluster Ion Beam).

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Plasma CVD method

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東邦化研

東邦化研

Electronic Components and Semiconductors

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Our company offers contract processing (coating services) for functional thin films using ion plating, vacuum deposition, sputtering, and plasma CVD. Since our inception, we have focused on "functional thin films" such as conductivity, insulation, and corrosion resistance. We accommodate various types of films, including metal films, reactive films like oxide, carbide, and nitride films, as well as their laminated films. We have established a system to respond to a wide range of requests, from small-scale prototypes, development, and research to medium-sized production runs. Currently, we have 11 deposition devices in operation, ranging from small machines with a diameter of 300mm to inline mass production machines with a film formation area of 1000mm x 900mm. All processes, from the unboxing of substrates entrusted by customers to the packaging of the coated products, are conducted within a clean room. If you are considering functional thin films, please feel free to contact us! Based on our flexible response and over 35 years of experience, we will meet your needs! *Information about our exhibition participation is also available on our website. Please take a look.

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