Multi-cutting processing of difficult-to-cut materials!
Diamond wire saw processing is a multi-cutting process for difficult-to-cut materials. 《Features of the processing machine》 - High-speed cutting with a wire travel speed of 1,500 m/min. - The oscillation mechanism makes it ideal for cutting difficult materials such as sapphire, SiC, and GaN. - Improved cutting speed, reduced breakage rate, and high-precision processing are possible through point contact cutting with arc control of the oscillation. For more details, please download the PDF or feel free to contact us.
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basic information
<Work Size and Processing Specifications> Workpiece/Maximum Size: Φ200mm Workpiece/Maximum Length: 300mm Table/Stroke: 220mm Cutting Clearance: ～0.18mm
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<Main Processing Achievements> Material: SiC Single Crystal Size: Φ4 inches Warping: 0.04mm or less TV5: 0.02mm or less Material: Sapphire Size: Φ4 inches Warping: 0.02mm or less TV5: 0.01mm or less Material: Carbide Size: □1 inch Warping: 0.03mm or less TV5: 0.02mm or less
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Company information
Ceratec Japan is a specialized company in the processing of electronic materials and optical materials. In addition to our accumulated processing achievements and technologies, we utilize a variety of processing equipment to provide a consistent system from processing to quality assurance. We are continuously making efforts to respond to our customers' trust and ensure a safe and reliable transaction.
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