High-purity insulating materials for the purpose of sealing semiconductor chips!
"Die Attach Adhesive" is one of the methods for mounting bare chips, where the circuit side of an IC chip with metal bump electrodes is adhered to the opposite side of the mounting substrate using a dispensing type insulating material for the mounting technology. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ One of the methods for bare chip mounting ■ Dispensing type *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■DA 8483: Printing type, B-stage type ■DA 8481-8: Dispensing type ■DA 8465-12: Transparent type ■DA 8472-1: White, high thermal conductivity type *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Sealing of semiconductor chips *For more details, please refer to the PDF document or feel free to contact us.*
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Namix Corporation is a company engaged in the research, development, manufacturing, and sales of electrochemical materials. By refining the material technology cultivated since its founding and strengthening the development of new technologies, we propose products that realize our customers' potential needs.