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  6. 『PGA460』

『PGA460』

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last updated:Sep 13, 2017

日本テキサス・インスツルメンツ
日本テキサス・インスツルメンツ

Ultrasonic signal processor and transducer driver 'PGA460'

The PGA460 device is a highly integrated system-on-chip ultrasonic transducer driver and signal conditioner, featuring an advanced DSP core. This device includes a complementary low-side driver pair, allowing it to drive transducers using either a boost transformer-based topology or a direct drive topology with external high-side FETs. The device can receive and condition reflected echo signals, enabling reliable object detection. This functionality is achieved using an analog front end (AFE), which consists of a low-noise amplifier and a subsequent programmable time-varying gain stage that supplies signals to the ADC. **Features** - Fully integrated solution for ultrasonic sensing - Low-noise receiver with programmable 6-point time-varying gain - Built-in DSP for echo envelope detection (BPF, demodulation) - Object detection with 12-point time-varying threshold and two presets *For more details, please contact us.*

    SensorsOther semiconductorsSoftware (middle, driver, security, etc.)
PGA460.jpg

『PGA460』

PGA460.jpg
PGA460.jpg
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basic information

【Other Features】 ■ Measures multiple echo distances and durations using a timer ■ Built-in temperature sensor ■ Object detection up to 11m with time recording ■ Echo recording with 128 bytes of RAM ■ Saves configuration in 42 bytes of user EEPROM for fast initialization ■ One-wire high voltage time-command interface or USART asynchronous interface ■ CMOS level USART interface ■ Sensor diagnostics (attenuation frequency and time, excitation voltage), power supply, and transceiver diagnostics *For more details, please contact us.

Applications/Examples of results

【Usage】 ■ Ultrasonic radar ■ Detection of object distance and position ■ Presence and proximity detection ■ Landing assistance and obstacle detection for drones and robotics ■ Human presence sensor and motion sensor *For more details, please contact us.

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日本テキサス・インスツルメンツ

日本テキサス・インスツルメンツ

Electronic Components and Semiconductors

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Texas Instruments (Headquarters: Dallas, Texas, USA; Chairman, President, and CEO: Rich Templeton; Abbreviation: TI) supports customers in developing new electronic devices that make the world "more convenient, healthier, safer, environmentally friendly, and enjoyable," and works together to solve challenges. TI has manufacturing, design, and sales locations in over 30 countries worldwide and continues to pursue innovation. TI's analog ICs and embedded processing support everyday life from behind the scenes in a society overflowing with digital devices. The company is actively investing in products and technologies for markets that will become increasingly important in the future, such as the environment, energy, healthcare, medical devices, and security. Technical Inquiry Contact TI Japan Product Information Center 【http://www.tij.co.jp/pic/】

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