With plating technology and the latest equipment, we will deliver the necessary products when you need them!
At Sansui Electronics Co., Ltd., we have introduced cutting-edge plating technology that enables the deposition of high-density patterns. We respond to client demands with high reliability. 【Features】 ■ Capable of depositing high-density patterns ■ High reliability *For more details, please contact us.
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basic information
【Technology Introduction】 ■ High Slow - Achieves throwing power of over 80% ■ Film Thickness Uniformity - Capable of producing 110,000 square meters per month across the entire factory ■ Flex (Tatsumi Factory) - Production of 0.03mm thickness is possible using frame jigs ■ Laser Via (Tatsumi Factory) - Plating on laser vias with a hole diameter of 100 microns is possible ■ Rigid Flex (Tatsumi Factory) - Plating that does not peel off can be applied to window opening types with exposed polyimide - Enhanced support for plating production on rigid flex substrates ■ Small Diameter Support (Tatsumi Factory) - Cutting-edge plating technology enables plating on extremely small diameter holes *For more details, please contact us.
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Company information
At Sansui Electronics Co., Ltd., we engage in printed circuit board plating and processing. Our team of technology experts is dedicated to responding accurately to our customers' needs through ongoing technological development. With a mission to manufacture through-hole plating, we contribute to the electronics industry and work towards building a prosperous society based on connections between people.
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