We will report rapid analysis results using various sampling techniques regarding foreign substances that significantly impact the yield of electronics products.
■Special Sampling Techniques for Foreign Substances in Multilayer Films - Foreign substances buried in metal films on substrates Metal film etching ⇒ Transfer to Si wafer ⇒ FT-IR analysis - Foreign substances in multilayer films Cutting off the surface layer ⇒ Transfer to Si wafer ⇒ FT-IR analysis Microtome/FIB thinning ⇒ Transfer to Si wafer ⇒ FT-IR analysis
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■Further enhanced micro-sampling tool The newly introduced micro-sampling tool captures targeted foreign substances accurately using a manipulator under a microscope. ■Even microscopic foreign substances less than 5 micrometers can be collected in large quantities and measured using FT-IR.
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Special sampling technique for foreign substances in multilayer films.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.