It is optimized for small lot production and research and development institutions.
The compact vertical grinding machine from the "Trinity-Y" series has been born. It is particularly suitable for grinding hard and brittle materials, making it ideal for small lot production and research and development institutions. Furthermore, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste. Additionally, combining it with other Trinity-Y models enables space-saving and the creation of an efficient, high-performance processing system. 【Specifications】 [HVG-200/HVG-250] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ200mm / φ250mm For more details, please contact us or download the catalog.
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basic information
【Specifications】 [HVG-200/HVG-250] ○Rotational Speed: Maximum 20,000 rpm / Maximum 2,000 rpm ○Work Table Dimensions: φ200mm / φ250mm ○Rotational Speed: Maximum 400 rpm / Maximum 450 rpm ○Control: PLC / PLC ○Operation Panel: LCD Soft Touch Panel 7.4 inch / LCD Soft Touch Panel 12.1 inch ○Device Size (W×D×H): 800mm×800mm×1900mm / 1000mm×1100mm×1800mm ○Device Weight: 1,100 kgf / 2000 kgf ●For more details, please contact us or download the catalog.
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Applications/Examples of results
Power device wafer processing, MEMS, LED backlighting, semiconductor wafers, etc. ● For more details, please contact us or download the catalog.
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Company information
Our company is committed to providing cutting-edge lap technology based on the know-how of diamond wrapping that our sister companies in the United States and various European countries have accumulated over many years. All of our staff sincerely look forward to serving customers who seek higher precision and quality in wrapping process technology.
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