It is possible to achieve processing efficiency and high precision flatness.
The horizontal grinding machine "EHG-170AV" performs grinding operations while the grinding wheel axis and work axis rotate in opposite directions. The grinding wheel axis also oscillates left and right, enabling high processing efficiency and high precision flatness. By selecting the appropriate grinding wheel, it demonstrates effective power on almost all workpieces, including ceramics, and a wide range of difficult-to-machine materials. 【Specifications】 [EHG-170AV/EHG-250NC] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ180mm / φ250mm ○ Rotational speed: maximum 2,500rpm / maximum 2,000rpm For more details, please contact us or download the catalog.
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【Specifications】 [EHG-170AV/EHG-250NC] ○Work table dimensions: φ170mm/φ250mm ○Rotational speed: Maximum 560rpm/Maximum 300rpm ○Control: PLC/PLC ○Operation panel: LCD soft touch panel 7.4inch/ LCD soft touch panel 12.1inch ○Device size (W×D×H): 1300mm×620mm×1317mm/ 1150mm×780mm×1450mm ○Device weight: 800kgf/900kgf ●For more details, please contact us or download the catalog.
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Our company is committed to providing cutting-edge lap technology based on the know-how of diamond wrapping that our sister companies in the United States and various European countries have accumulated over many years. All of our staff sincerely look forward to serving customers who seek higher precision and quality in wrapping process technology.