We will exhibit at the trade show "SEMICON JAPAN 2017" (Event dates: December 13, 2017 - December 15, 2017).

Demo now available! Everything you need for wrapping equipment is here! Polishing equipment for automobiles and hydraulic machinery is also available.

At Japan Engis, which offers a full range of wrapping and polishing equipment, we are currently giving away our "Comprehensive Catalog," which includes the latest products, for free! Notably, we have the 'Bore Finish System' for the automotive and hydraulic industries. This new product improves inner diameter dimensional accuracy compared to traditional honing machine finishes! It significantly enhances production efficiency and reduces costs. Additionally, we have a wide variety of consumables listed, including slurries, brushes, and polishing cloths. ◎ We are currently accepting "live demonstrations" at our lab! Please contact us through "Inquiries." 【Contents Included】 ■ Precision wrapping equipment ■ Multifunctional polishing system "Trinity-Y" ■ Precision large wrapping/polishing equipment ■ Precision grinding machine series ◎ Other items listed include wrapping accessories, diamond slurries, polishing slurries, polishing cloths, wrapping plates, diamond pastes, and polishing materials for mold finishing, among many others!

• Other processing machines

It is a wrapping device capable of being equipped with a fencing device.

The ultra-precision single-sided lapping machine 'EJW-460I' is a highly versatile device that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ460 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Capable of being equipped with a facing device (automatic plate correction device) - Standard equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

• Other processing machines

It is optimized for small lot production and research and development institutions.

The compact vertical grinding machine from the "Trinity-Y" series has been born. It is particularly suitable for grinding hard and brittle materials, making it ideal for small lot production and research and development institutions. Furthermore, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste. Additionally, combining it with other Trinity-Y models enables space-saving and the creation of an efficient, high-performance processing system. 【Specifications】 [HVG-200/HVG-250] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ200mm / φ250mm For more details, please contact us or download the catalog.

• Grinding Machine

Engis, boasting excellent diamond grading technology, meets user demands with a wide variety of slurries!

Engis, which developed diamond slurry based on the demands of the electronics industry, supplies a variety of ultra-precision slurries.

• Lubricants
• others

Birth of a multifunctional compact CMP-compatible double-sided polishing device!

A compact and multifunctional CMP-compatible double-sided polishing device in size 6B has been developed from the "Trinity-Y" series. It is made with a full stainless steel dust cover and thoroughly uses corrosion-resistant materials throughout, making it suitable for all types of slurries and ideal for simultaneous double-sided polishing of difficult-to-machine materials. Additionally, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste.

• Wafer processing/polishing equipment

It is possible to achieve processing efficiency and high precision flatness.

The horizontal grinding machine "EHG-170AV" performs grinding operations while the grinding wheel axis and work axis rotate in opposite directions. The grinding wheel axis also oscillates left and right, enabling high processing efficiency and high precision flatness. By selecting the appropriate grinding wheel, it demonstrates effective power on almost all workpieces, including ceramics, and a wide range of difficult-to-machine materials. 【Specifications】 [EHG-170AV/EHG-250NC] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ180mm / φ250mm ○ Rotational speed: maximum 2,500rpm / maximum 2,000rpm For more details, please contact us or download the catalog.

• Grinding Machine

Announcement of Exhibition. We will be exhibiting at the Reborn Challenge Showcase in Grand Green Osaka JAM BASE. [Exhibits] Bioplastics Sakura plates Cutlery

We are pleased to announce that our company will be exhibiting at "EdgeTech+ 2025" (held in Yokohama). <Overview of EdgeTech+ 2025> Exhibition Name: EdgeTech+ 2025 (https://www.jasa.or.jp/expo/) Dates: November 19 (Wednesday) to November 21 (Friday), 2025, 10:00 AM to 5:00 PM (until 6:00 PM on November 20, Thursday) Venue: Pacifico Yokohama Exhibition Hall / Annex Hall Organizer: Japan Embedded Systems Technology Association Admission: Free (pre-registration required) <Booth Information> Booth Number: CS-07 <Main Exhibits> - UHF Band RFID Reader/Writer Module [TPURID2100] - 920MHz Band LPWA Wireless Communication Module [TPSW9] - 2.4GHz Band Wireless Communication Module [TPBPM] - Positioning Starter Kit We understand that you may be busy, but we sincerely hope you will take this opportunity to visit us and stop by our booth.

We are pleased to announce that our company will be exhibiting at the "Industrial Exchange Exhibition 2025." <Overview of the Industrial Exchange Exhibition 2025> Exhibition Name: Industrial Exchange Exhibition 2025 (https://www.sangyo-koryuten.tokyo/) Dates: November 26 (Wednesday) to November 28 (Friday), 2025, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, West Halls 1 and 2 Admission: Free (pre-registration required) <Booth Information> Booth Number: B-04 (within the Tokyo Business Frontier Pavilion) <Main Exhibits> - UHF Band RFID Reader/Writer Module [TPURID2100] - 920MHz Band LPWA Wireless Communication Module [TPSW9] - 2.4GHz Band Wireless Communication Module [TPBPM] - Positioning Starter Kit We understand that you are busy, but we sincerely hope you will take this opportunity to visit us and stop by our booth.

100% participant satisfaction! Packed with useful information for ISMS managers! You can watch the video of the "ISMS Manager Study Session" held in Shinbashi in September 2025. The theme this time is "Latest Trends and Information Leakage Countermeasures." 【What You Can Learn】 ● The latest trends in ISMS audits and what to do before the next audit - How to efficiently run the PDCA cycle - Recent trends in audits - What to do before the next audit ● Recent trends in information leakage incidents and unauthorized access, and the information security measures to focus on now - Recent trends in information leakage incidents and unauthorized access - Key points for countermeasures based on these trends - Information security measures to focus on now 【Recommended For】 - Executives and personnel from companies that have obtained ISMS certification - Those who want to know what to prepare for the next ISMS audit - Those who want to know how to respond to recent security trends - Those who want to operate ISMS more efficiently. You can also download the materials distributed at the seminar. Please apply!

[Speaker] Taigo Isobe, Senior Manager, Innovation Center, Innovation Technology Department, NTT Data Corporation [Key Lecture Content] Quantum computers are attracting attention as a new computational mechanism based on quantum mechanics, providing innovative solutions to complex and large-scale problems that have been difficult to handle with traditional classical computers. In this lecture, I will first overview the foundational technologies and current status of quantum computers, organize the application examples that have been highlighted in the financial and chemical fields, and then outline the potential in new application areas such as odor reconstruction, weather forecasting, and digital agriculture. I hope you will realize that quantum computers are not just an extension of computational technology but are expanding into diverse areas such as perception, environment, and human sensibility.