We will exhibit at the trade show "SEMICON JAPAN 2017" (Event dates: December 13, 2017 - December 15, 2017).

Demo now available! Everything you need for wrapping equipment is here! Polishing equipment for automobiles and hydraulic machinery is also available.

At Japan Engis, which offers a full range of wrapping and polishing equipment, we are currently giving away our "Comprehensive Catalog," which includes the latest products, for free! Notably, we have the 'Bore Finish System' for the automotive and hydraulic industries. This new product improves inner diameter dimensional accuracy compared to traditional honing machine finishes! It significantly enhances production efficiency and reduces costs. Additionally, we have a wide variety of consumables listed, including slurries, brushes, and polishing cloths. ◎ We are currently accepting "live demonstrations" at our lab! Please contact us through "Inquiries." 【Contents Included】 ■ Precision wrapping equipment ■ Multifunctional polishing system "Trinity-Y" ■ Precision large wrapping/polishing equipment ■ Precision grinding machine series ◎ Other items listed include wrapping accessories, diamond slurries, polishing slurries, polishing cloths, wrapping plates, diamond pastes, and polishing materials for mold finishing, among many others!

• Other processing machines

It is a wrapping device capable of being equipped with a fencing device.

The ultra-precision single-sided lapping machine 'EJW-460I' is a highly versatile device that can be equipped with a facing device. The model with the facing attachment allows anyone to easily correct the flatness of the lapping plate in just a few minutes. In lapping processes that rigorously pursue accuracy, it is always possible to obtain workpieces with stable flatness. 【Usable plate outer diameter: Φ460 mm】 <Features> - Can be used for polishing various materials by selecting the appropriate plate (lapping plate) - Capable of being equipped with a facing device (automatic plate correction device) - Standard equipped with a water cooling mechanism (cooling device required separately) - Compatible with various options* *Please feel free to consult us if you have any requests.

• Other processing machines

It is optimized for small lot production and research and development institutions.

The compact vertical grinding machine from the "Trinity-Y" series has been born. It is particularly suitable for grinding hard and brittle materials, making it ideal for small lot production and research and development institutions. Furthermore, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste. Additionally, combining it with other Trinity-Y models enables space-saving and the creation of an efficient, high-performance processing system. 【Specifications】 [HVG-200/HVG-250] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ200mm / φ250mm For more details, please contact us or download the catalog.

• Grinding Machine

Engis, boasting excellent diamond grading technology, meets user demands with a wide variety of slurries!

Engis, which developed diamond slurry based on the demands of the electronics industry, supplies a variety of ultra-precision slurries.

• Lubricants
• others

Birth of a multifunctional compact CMP-compatible double-sided polishing device!

A compact and multifunctional CMP-compatible double-sided polishing device in size 6B has been developed from the "Trinity-Y" series. It is made with a full stainless steel dust cover and thoroughly uses corrosion-resistant materials throughout, making it suitable for all types of slurries and ideal for simultaneous double-sided polishing of difficult-to-machine materials. Additionally, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste.

• Wafer processing/polishing equipment

It is possible to achieve processing efficiency and high precision flatness.

The horizontal grinding machine "EHG-170AV" performs grinding operations while the grinding wheel axis and work axis rotate in opposite directions. The grinding wheel axis also oscillates left and right, enabling high processing efficiency and high precision flatness. By selecting the appropriate grinding wheel, it demonstrates effective power on almost all workpieces, including ceramics, and a wide range of difficult-to-machine materials. 【Specifications】 [EHG-170AV/EHG-250NC] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ180mm / φ250mm ○ Rotational speed: maximum 2,500rpm / maximum 2,000rpm For more details, please contact us or download the catalog.

• Grinding Machine

We will be exhibiting at the "P-MEC Japan 2025 Pharmaceutical Ingredients and Equipment Exhibition" held at Tokyo Big Sight. During the event, we will showcase various products. We invite all relevant parties to come and visit us. 【Suppliers】 ・LAUDA

Seiko Co., Ltd. will be exhibiting at the "11th Monozukuri World Nagoya" held at Port Messe Nagoya. This exhibition features approximately 630 companies showcasing advanced technologies that contribute to shortening development and manufacturing periods, promoting DX and IT, reducing costs, and enhancing energy efficiency and automation in factories, including IT and DX products, parts, equipment, devices, and measurement products. We plan to display the actual cabinet for equipment management, "SMART BEE," so please be sure to visit us. 【Model Numbers】 ■ Vending Machine Type Tool Management Cabinet Smart Bee X, Smart Bee S, Cute Bee, Smart Bee Pro ■ Locker Shelf Type Tool and Consumables Management Cabinet T Series: T57, T100, T108 TW Series (with electronic scale): TW45, TW68, Hyper S, Hive

We will be exhibiting at "Japan DX Week Spring 2026," which will be held at Tokyo Big Sight from April 8 (Wednesday) to April 10 (Friday). At the Marble booth, we plan to showcase how AI can improve work efficiency and lead to business automation in on-site operations. Additionally, we will provide an opportunity to experience a demonstration utilizing the latest technology, AR. Furthermore, for our manufacturing industry customers, we will present proposals under the theme "Utilizing Drawings to Drive DX," promoting the digitalization of design and quality areas, and introducing packaged products and custom services aimed at enhancing productivity in the manufacturing sector.

Core systems are the foundational support for corporate management, and their importance is increasingly heightened in the DX era, where data becomes a source of competitive advantage. To respond swiftly and flexibly to the rapidly changing business environment, a transformation in the nature of systems is required. We will introduce a method to realize a highly flexible and scalable business system that promotes operational efficiency and data utilization through the combination of kintone and ASTERIA Warp, using examples and demonstrations.

The widespread adoption of generative AI is rapidly evolving from traditional "conversational AI" to "autonomous execution AI (AI agents)." The AI agents that have recently garnered attention are not limited to merely generating responses; they can incorporate an autonomous processing flow of "planning → task decomposition → execution → evaluation," serving as new partners that can substitute and expand users' business operations. In this seminar, we will clearly introduce the following topics, incorporating examples of the AI solution "AIdea Suite AGENT +plus" and the data integration tool "ASTERIA Warp": - Why "AI agents" are becoming essential for corporate competitiveness now - The mechanisms of AI agents and specific use cases - Methods for establishing business efficiency, creating new value, and gaining a competitive edge - Specific steps for implementing AI agents - Data integration and its methods, which are essential for utilizing AI *This is a re-broadcast of the seminar held on October 30, 2025 (Thursday).