Birth of a multifunctional compact CMP-compatible double-sided polishing device!
A compact and multifunctional CMP-compatible double-sided polishing device in size 6B has been developed from the "Trinity-Y" series. It is made with a full stainless steel dust cover and thoroughly uses corrosion-resistant materials throughout, making it suitable for all types of slurries and ideal for simultaneous double-sided polishing of difficult-to-machine materials. Additionally, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste.
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basic information
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Price range
P6
Delivery Time
Applications/Examples of results
Power device substrates (GaN, SiC, etc.) double-sided polishing, sapphire substrates, smartphone components, HDD substrates, etc.
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Company information
Our company is committed to providing cutting-edge lap technology based on the know-how of diamond wrapping that our sister companies in the United States and various European countries have accumulated over many years. All of our staff sincerely look forward to serving customers who seek higher precision and quality in wrapping process technology.
