For semiconductor substrate leads and measuring instruments! Wire drawing and rolling processing, clad lamination processing.
At Nikko, we specialize in wire drawing and rolling processing, as well as clad lamination processing. After plating treatment, wire drawing and rolling processing can maintain uniform coating properties due to the fiber crystallization of the plated surface layer. Our products are widely used for free alignment connectors, semiconductor substrate leads, diode leads, measurement instruments, and various sensors. 【Features】 ■ Wire drawing and rolling processing, as well as clad lamination processing ■ Widely utilized for measurement instruments and various sensors *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Specifications】 ■ Ultra-fine wire diameter φ0.02mm ■ Rolled processing, thickness 0.01mm × width 0.05mm *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Brass wire ■ Platinum wire *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our business is broadly divided into two sectors: the trading division and the manufacturing division. The trading division sells materials such as cobalt, nickel, and tungsten, as well as their secondary products, including electronic materials, magnetic materials, and other plant materials. The manufacturing division is located in Saitama and Fukushima Prefectures for manufacturing and technology development, and has production bases overseas in the Philippines and China, producing high-quality and precision products such as computer peripherals, semiconductor and FPD manufacturing equipment parts, magnetic sensors, solenoids, and security devices.
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