Fluxless solder die bonding (wire solder) for power semiconductors. Multi-chip mounting support available as an option!
Fluxless solder bonder for power semiconductors 'DBD3580S' Compatible with multi-row work such as Power QFN with a maximum width of 100mm. 【Specifications】 ■ Bonding process: wire solder application ■ Chip size: □1.0~6.0mm ~10.0mm (optional) ■ Bonding accuracy (XY): +/-50μm ■ Bonding accuracy (Θ): +/-3° ■ Bond/pick load: 30~200gf ■ Compatible work: lead frame or carrier ■ Maximum width supported: up to 100mm ■ Wafer size: 6 inches or 8 inches ■ Disco ring or expand ring ■ Machine cycle time: 0.60 seconds/chip, depending on various conditions ■ Pin transport ■ External dimensions: 2,000x1,235x1,650mm ■ Weight: 1,300kg ■ Main options: wafer changer (standard specification), magazine loader, wafer map, punch unit, etc. *For more details, please refer to the catalog or feel free to contact us.
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We inherit the die bonding technology of Nidec Tosok Corporation and are implementing automation of semiconductor manufacturing equipment based on that technology. We are actively developing new projects and aim to contribute to the business of our partner companies through original product development. While further refining the technology established since our founding, we pursue the creation of products that combine high convenience and reliability, and we will continue to grow towards a valuable future.