It is a high-precision die bonder optimized for mass production of optical devices. Additionally, we also offer the highly precise FDB210P in our lineup.
This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip and mounting. There are two types: the FDB210 model, which supplies chips and substrates via trays, and the FDB211 model, which supplies with grip rings.
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basic information
Main Features ■ Compatible with microchips (0.25mm and above) (Option: 0.15mm and above) ■ High precision mounting achievable at ±2μm (3σ) High precision positioning is achieved through a high-rigidity frame and fully closed-axis control, along with an automatic calibration function that ensures stable mounting accuracy. ■ Supports various processes Broad compatibility with processes such as eutectic bonding and resin bonding, equipped with monitoring functions after mounting, making process control easy. Options ■ Ultrasonic head ■ Resin transfer mechanism ■ Multi-chip compatibility ■ N₂ purge mechanism ■ Face-up mounting capability
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Applications/Examples of results
High-precision die bonder High-precision flip chip bonder COC and COS process implementation for optical device and laser module manufacturing Supports eutectic bonding, resin bonding, and more
Company information
Our company is headquartered in Kanazawa City, Ishikawa Prefecture, and has sales offices and factories both within and outside the prefecture. We focus on the bottling business, which involves filling beverages and other products, and we are expanding into various fields such as solid-liquid mixing and dispersion systems, laser processing machines (including fiber lasers and CO2 lasers), and semiconductor assembly equipment (such as taping machines, multifunctional test handlers, ball mount machines, and bonders). Please feel free to contact us if you have any inquiries.
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