Die bond for hoop frames, compatible with both eutectic and epoxy (dual-use specification available), supports small chips (from 0.15mm) and provides stable operation!
Die Bonder for Hoop Frame "DBD4200R" Compatible with small chips starting from 0.15mm. 【Specifications】 ■ Joining process: Eutectic/Epoxy/Combined machine specifications ■ Chip size: □0.15~1.0mm (Eutectic) ~3.0mm (Epoxy) ■ Bond accuracy (XY): +/-35μm ■ Bond accuracy (Θ): +/-3° ■ Bond/Pick load: 30~200gf ■ Compatible work: Lead frames or substrates, carriers ■ Maximum width supported: Up to 78mm ■ Wafer size: 6 inches or 8 inches ■ Disco ring or expand ring ■ Machine cycle time: 0.25 seconds/chip (Eutectic), depending on various conditions ■ Transport method: Roller transport ■ External dimensions: 1,740x1,150x1,185mm ■ Weight: 1,000kg ■ Major options: Rotary bond head, uncoiler, cutter, wafer map, post-bond recognition, etc. *For more details, please refer to the catalog or feel free to contact us.
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We inherit the die bonding technology of Nidec Tosok Corporation and are implementing automation of semiconductor manufacturing equipment based on that technology. We are actively developing new projects and aim to contribute to the business of our partner companies through original product development. While further refining the technology established since our founding, we pursue the creation of products that combine high convenience and reliability, and we will continue to grow towards a valuable future.