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  1. Home
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  3. Manufacturing and processing machinery
  4. Processing Machinery
  5. Other processing machines
  6. Short pulse laser processing machine [for drilling and cutting silicon wafers, etc.!]

Short pulse laser processing machine [for drilling and cutting silicon wafers, etc.!]

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last updated:Dec 07, 2017

PHYSICAL PHOTON
PHYSICAL PHOTON
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A short pulse laser processing machine used for drilling and cutting silicon wafers!

The "Short Pulse Laser Processing Machine" is a processing machine that is applied to drilling, cutting of silicon wafers, and laser patterning of thin-film solar cell materials due to its features such as high output and fine processing. Additionally, it is used for cutting and drilling of lithium battery metal films, substrate cutting, and sapphire cutting. 【Features】 ■ Output: 20W, Pulse Width: 100ps ■ Peak Power Output: 300kW ■ Frequency: Adjustable from 30kHz to 1000kHz ■ Pulse Energy: 300μJ@1ns ■ Beam Quality: M2 < 1.3 *For more details, please request materials or view the PDF data available for download.

    Other processing machinesLaser marker
image_38.jpg

Short pulse laser processing machine [for drilling and cutting silicon wafers, etc.!]

image_38.jpg
image_38.jpg

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basic information

【Application Areas】 ■ Drilling holes in silicon wafers, cutting, laser patterning of thin-film solar cell materials, cutting and drilling of lithium battery metal films, substrate cutting, sapphire cutting, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

For more details, please refer to the PDF document or feel free to contact us.

Detailed information

  • image_39.jpg

    Processing Examples Battery Manufacturing Field

  • image_40.jpg

    Processing Example Wafer Cutting

  • image_41.jpg

    Processing examples: Sapphire cutting, drilling

  • image_01.jpg

    Processing example: Silicon cutting

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PHYSICAL

PHYSICAL PHOTON

Industrial Machinery

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Our company handles UV (ultraviolet) laser markers, MOPA laser markers, YAG laser welding machines, and fiber laser welding machines. Please consult us for fine processing of new materials and metals, as well as welding of dissimilar metals. We can provide equipment for laser applications such as laser welding, laser marking, laser surface treatment, peening, and laser rust removal (cleaning devices). We have particular strengths in the fields of precision welding and UV laser processing. We excel at proposing systems tailored to customer needs. Even in areas where laser processing is not yet common, we make the impossible possible using our own processes. If you have any ideas like "It would be nice if..." or "It would be convenient if...", please feel free to consult us. 1. We can propose and provide laser-related equipment compatible with various wavelengths, especially with expertise in welding-related and UV laser-related technologies! 2. We can propose not only standalone lasers but also systems (including design and manufacturing of transport systems, jigs, and provision of inspection units). 3. Our equipment is offered at lower prices and shorter delivery times compared to competitors. 4. We provide prompt after-sales service and can arrange replacement parts through a global procurement network, including after-sales support with repairs by domestic technicians.

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