Join wafers and bulk without applying heat!
This product is a mass production machine-based device that activates the bonding surface with an Ar beam under ultra-high vacuum (10^-6 Pa) and joins wafers and bulk materials at room temperature and without pressure. Since it joins materials without heating, it contributes to shortening and streamlining the production process. We have infused our long-cultivated ultra-high vacuum technology to achieve high operability and maintainability. 【Features】 ■ Can bond materials with different thermal expansion rates due to non-heating ■ Bonding time per set is approximately 5 to 10 minutes ■ Device returns to operation about 12 hours after maintenance ■ Numerous bonding achievements with various materials ■ Many delivery records in production sites *For more details, please download the PDF or feel free to contact us.
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basic information
【Specifications】 ■ Surface activation uses FAB gun ■ Throughput 5-10 minutes per set ■ UHV specifications (achievable vacuum level in the 10^-6 Pa range) *For more details, please download the PDF or feel free to contact us.
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Our company is a group of engineers that develops practical devices using extreme technologies based on vacuum creation technology. While we also sell standard products, we actively respond to the development of custom-made products. Instead of offering off-the-shelf products, we provide proposals tailored to our customers' needs, and we have developed many unique devices that are one-of-a-kind in the world, helping to make what was previously impossible possible. Please feel free to contact us with your requests.