Using diamond wire for edge trimming of brittle materials, optimal for cutting silicon wafers, glass, quartz, and more.
- It is ideal for prototype and research cutting using a diamond wire saw. - Automatic cutting is possible with an XY table using a high-precision 5-phase micro-stepping motor closed-loop system. The X-axis comes with a rotation mechanism. - Cutting under constant stress: During cutting, the deflection of the wire is detected by a high-precision position sensor, allowing for feedback to the stepping motor to control the movement speed, thus maintaining constant stress. - Simple design with easy operation via a touch panel.
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basic information
Please check the catalog.
Price range
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Applications/Examples of results
For evaluation purposes, a workpiece will be cut with a single wire. Using a diamond wire, it is suitable for edge trimming of brittle materials and cutting of silicon wafers, glass, quartz, etc.
Detailed information
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The main body. The safety cover is optional.
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Cooling circulator option
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Company information
July 2009: Received certification for a research and development plan related to the advancement of manufacturing infrastructure technology for small and medium-sized enterprises from the Ministry of Economy, Trade and Industry. June 2010: Began joint development with the National Institute of Advanced Industrial Science and Technology on glass etching for solar cells. February 2011: Ordered and received an 8-inch chemical cleaning system for the 3D semiconductor research center. July 2011: Contracted by Saitama Prefecture for the next-generation industry entry support project. November 2011: Developed an alkaline spin etching system. Specifications: For large substrates (300 mm square). February 2012: Completion of the next-generation industry entry support project in Saitama Prefecture. April 2012: Newly developed silicon wafer separator for solar cells.