A device that presses against a wire tool running at high speed on a guide roller to perform slicing processing!
A "multi-wire saw" is a device that fixes the workpiece to a descending table and presses it against a wire tool that runs at high speed over guide rollers to perform slicing operations. The "guide rollers" have grooves formed at pitches that match the thickness of the product to be processed. Depending on the pitch, it is possible to wind dozens to thousands of wires. 【Features】 ■ Minimal cutting loss ■ Cost-effective and high yield slicing ■ Good thickness and flatness accuracy ■ Capable of slicing thin sheets of about 0.1mm *For more details, please refer to the PDF document or feel free to contact us.
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【Usage Examples】 ■Example 1: From ingot to sheet ■Example 2: From rod to individual pieces ■Example 3: From sheet to individual pieces <Applicable Materials> - Crystalline materials, sintered materials, glass, resin, metals, etc. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our main business focuses on precision processing of various hard materials, specializing in "grinding and cutting," including ceramics, crystalline materials, glass, metals, and resins. In recent years, we have particularly concentrated on ultra-precision cutting and polishing of various ceramics required for electronic components, as well as the power semiconductor field represented by SiC single crystals. In cutting technology, we can perform multi-wire cutting using a fixed abrasive method with diamond wire, and in polishing technology, we can achieve ultra-mirror polishing at the nano level. Additionally, in September 2023, we became Neos Group through M&A, establishing a consistent production system within the group that incorporates Neos's expertise in ultra-precision cleaning technology. If you have any issues with cutting, polishing, or cleaning processes, please feel free to contact Shinko Seisakusho!