Large-capacity powder surface modification device
This product is a processing device capable of large-capacity surface modification of powders (improving dispersion in solutions, pretreatment for coating, etc.). By applying "fluidized bed" technology, which allows for mixing and stirring powders like liquids, it efficiently exposes the powders to active species generated by plasma, separating the plasma generation area from the processing area. Additionally, since it does not require a vacuum chamber, scaling up is easy. It has become applicable to uses that could not be adopted with conventional devices. 【Features】 ■ Large-capacity processing ■ Applicable to carbon powders and advanced technologies *For more details, please download the PDF or feel free to contact us.
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basic information
This is a processing device that enables large-capacity treatment of powder surfaces by combining plasma technology and fluidized bed technology. Electrode materials for secondary batteries, *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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Company information
KAI Semiconductor was established in September 2002 as a venture company originating from Kyoto Institute of Technology. It sells surface modification devices and deposition equipment using plasma technology. The powder plasma device released in 2010 was recognized for its high technical capabilities and received the "Kansai Front Runner Award" and the "Small and Medium Enterprises Technology Award." There are numerous implementation records at universities nationwide, AIST, major manufacturers, and R&D departments. We propose sales after you have had the opportunity to touch the actual product (demo unit). Additionally, we offer rental and leasing options to reduce the burden on our customers. We also accept various technical consultations beyond semiconductor-related matters. Furthermore, we process and sell quartz and Pyrex in small lots.
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