A small, low-cost experimental laser lift-off device. For prototyping flexible displays and material development!
The "LSL-10" is an experimental device that forms a line beam using a solid-state UV pulse laser and moves the substrate on the workpiece with a stage to perform the LLO process across the entire surface. LLO allows for instantaneous delamination at the interface through laser irradiation using substrates that transmit laser light, such as glass and sapphire. This device is compact, low-cost, and can be moved using casters. It implements Class 4 safety measures. 【Features】 ■ Compact and low-cost (movable with casters) ■ Can be used with only an AC100V power supply ■ Class 4 safety measures (light path/sliding part shielding, interlock) *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■Wavelength: 355nm ■Line beam size: 10mm×1mm ■Irradiation energy density: 25–250mJ/cm² (variable attenuator) ■Work size (mm): Maximum 150×150, Option G2 (370×470) ■Processing capacity: Approximately 5 minutes (100×100 substrate) ■Stage stroke: 200mm×200mm ■Device size (mm): L1200×W900×H1500 ■Utility: AC100V±10% 15A *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Utilization Status】 ■ Flexible Display Post-Processing ■ LED Manufacturing ■ Ultra-Thin Silicon Wafer Process *For more details, please refer to the PDF document or feel free to contact us.
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We sell products in advanced fields that utilize laser technology.
![[Application Example] Semiconductor Manufacturing: Supporting Manufacturing Plants](https://image.mono.ipros.com/public/product/image/ca7/2000866226/IPROS75283110898564473927.png?w=280&h=280)
