Supports large substrates (515mm x 510mm)! Instant interface delamination is possible through laser irradiation.
This device uses a solid-state UV pulse laser to create a uniform line beam through our unique optical system, and it is designed to separate devices from substrates by moving the substrate on a stage. The separated substrates and devices are collected in a tray by a robotic arm. 【Features】 ■ Achieves a stable separation process with a uniform intensity line beam using a solid-state laser ■ No need for auxiliary equipment such as toxic gas, resulting in low cost and low running costs ■ Compatible with large substrates (515mm x 510mm) *For more details, please download the PDF or feel free to contact us.
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basic information
【Specifications】 ■Wavelength: 355nm (Options: 266/532nm) ■Line beam size: 40mm x 0.4mm (Type F) ■Beam uniformity: ±5% (long axis) ■Irradiation energy density: 4–300mJ/cm² (Control via variable attenuator) ■Beam overlap: 0%–95% (stage control) ■Work size: Maximum 515mm x 510mm ■Processing capacity: 5 minutes (Type D) / 20 minutes (Type F) ■Device size: L2800 x W1900 x H2100 *For more details, please download the PDF or feel free to contact us.
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Applications/Examples of results
【Application Examples】 ■ Flexible Display ■ Ultra-thin Silicon Wafer Process ■ Organic Semiconductor Process, etc. *For more details, please download the PDF or feel free to contact us.
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We sell products in advanced fields that utilize laser technology.
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