This is a product with a super compact, lightweight body designed to easily perform ultrasound examinations anywhere, without being limited to specific locations.
Features ● Compact tabletop size ● Ideal for analyzing voids, delamination, solder defects, and bonding failures ● Supports high-frequency ultrasound from 5 to 100 MHz (other frequencies available) ● High-resolution scanning with a minimum of 10 μm
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Features ● Compact tabletop design ● Ideal for analyzing voids, delamination, solder defects, and bonding failures ● Supports high-frequency ultrasound from 5 to 100 MHz (other frequencies available) ● High-resolution scanning with a minimum of 10 μm
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Features ● Compact tabletop design ● Ideal for analyzing voids, delamination, solder defects, and bonding failures ● Supports high-frequency ultrasound from 5 to 100 MHz (other frequencies available) ● High-resolution scanning with a minimum of 10 μm
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