Introducing an ultrasonic imaging device that supports various IC inspections, including JEDEC-TRAY IC inspections.
The "VSA M350" is an ultrasonic imaging device that supports various IC inspections, including JEDEC-TRAY IC inspections, 300mm wafer inspections, MLCC inspections, automotive parts inspections, and NO/GO judgment output. It has a pixel count of 100 million pixels and a scanning speed of 1200 mm/s. The measurement range is 350×350×80 mm. 【Specifications (excerpt)】 ■ Measurement range: 350×350×80 (mm) ■ Measurement pitch: 0.001 (mm) ■ Scanning speed: 1200 (mm/s) ■ Standard probe: 35 (MHz) ■ Pixel count: 100 million pixels *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Options】 ■Transmission method measurement (other probes): 5-150MHz ■Erosion measurement (multi-probe): 2-8ch multi-probe measurement *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company is engaged in the development, manufacturing, and sales of non-destructive testing equipment, measuring devices, and automatic inspection machines, as well as the development, manufacturing, and sales of related equipment for construction machinery. Our main products include the ultrasonic imaging device V3000 series and the heat exchanger piping inspection system PUT series. Please feel free to contact us if you have any inquiries.
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