Superior electrical and thermal properties due to special copper plating! Introducing the filling of DPC substrates.
"Through hole filling" refers to the process of filling holes in ceramic substrates that excel in electrical (low resistance) and thermal (high thermal conductivity) properties due to special copper plating. We will introduce hole filling for diameters of Φ0.1 mm, as well as Φ0.15 mm and Φ0.2 mm, with photos. *For more details, please refer to the PDF document or feel free to contact us.
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Located in Chino City, Nagano Prefecture, we are a printed circuit board manufacturer that offers services from design to implementation on circuit boards, from prototype development products to mass production. We have extensive experience in thermal management boards and can propose the most suitable materials and structures for our customers' applications. Additionally, in recent years, we have also been accommodating thick copper boards for high current applications with various substrates.