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  6. Colloidal silica polishing material for silicon wafers 'GLANZOX'

Colloidal silica polishing material for silicon wafers 'GLANZOX'

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last updated:Jan 22, 2019

フジミインコーポレーテッド
フジミインコーポレーテッド
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Meeting the demands for higher flatness, damage-free, and free from heavy metal contamination with a complete mirror finish!

"GLANZOX" has made it possible to achieve excellent polished surfaces by dispersing colloidal silica in a specially formulated liquid. In recent years, there have been strict reduction requirements for metallic impurities that affect device characteristics. In response, we have developed ultra-high purity colloidal silica. We offer dedicated polishing materials such as the "GLANZOX E Series" for finishing wafer edges to a mirror-like surface. 【Features】 ■ Disperses colloidal silica in a specially formulated liquid ■ Enables the realization of excellent polished surfaces ■ Developed ultra-high purity colloidal silica ■ Provides high-dimensional polishing materials *For more details, please refer to the PDF document or feel free to contact us.

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Colloidal silica polishing material for silicon wafers 'GLANZOX'

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  • Related Link - http://www.fujimiinc.co.jp/
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【Other Features】 <GLANZOX E Series> ■ A dedicated polishing material that finishes the wafer edge to a mirror surface ■ Based on colloidal silica ■ Prepared in a special composition solution ■ Excellent cleaning properties after polishing with high efficiency *For more details, please refer to the PDF document or feel free to contact us.

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フジミインコーポレーテッド

フジミインコーポレーテッド

Electronic Components and Semiconductors

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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.

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